Co-developed CBA (CMOS directly bonded to array) technology allows CMOS wafers and cell array wafers to be optimised and manufactured separately, and then bonded together in a stack for high bit density and high IO speed – 3.2Gbit/s is claimed for the latter.
“Through our engineering partnership, we have launched the eighth-generation ‘BiCS’ flash, with the industry’s highest bit density,” said Kioxia CTO Masaki Momodomi. “By applying CBA technology and scaling, we’ve advanced our flash memory for use in applications including smartphones, IoT devices and data centres.”