Scientists from the Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) have developed technology that can stack up to four layers of wafers.
IME has developed a multi-wafer fusion bonding process and a one-step TSV process that can stack up to four layers of wafers.
This was made possible by combining Face-to-Face and Back-to-Back wafer bonding with one-step TSV after stacking.
“The 3D integration, TSV process and multi-wafer fusion bonding technology breakthroughs will allow device manufacturers to better integrate 3D products with high added value, says MIME’s Kawano Masaya, “this development will mean new business opportunities with its low cost 3D-DRAM and manufacturing, for device manufacturers, equipment suppliers, and material suppliers.”