Combining Intrinsix’s chip design capabilities and IP with CEVA’s wireless connectivity and smart sensing IP enables a comprehensive IP platform.
For nearly 35 years, Intrinsix has been providing SoC design expertise in the areas of RF, mixed signal, digital, software, secure processors and interface IP for Heterogenous SoCs (HSoCs), otherwise referred to as chiplets.
With more than 1,500 designs with a customer base that includes Intel, IBM, Leidos and Lockheed Martin, Intrinsix commands a strong foothold in aerospace & defense, a market that is estimated to reach $6 billion in Semiconductor spending in 2022. Intrinsix is also involved in the development of chiplets and secure processors for DARPA projects.
“Intrinsix’s experience and customer base in the growing chip development programs with the U.S. Department of Defense and DARPA and its IP offerings for processor security and chiplets will extend CEVA’s serviceable market and revenue base,” says CEVA CEO Gideon Wertheizer.