CUI Devices adds BGA heat sinks

CUI Devices’ Thermal Management Group has expanded its heat sink product portfolio with the addition of BGA heat sinks. The HSB family, designed for ball grid array (BGA) devices, supports a range of sizes from 8.5 × 8.5 mm up to 60 × 60 mm with profiles from 6 mm up to 25 mm.

Like the company’s existing line of board-level heat sinks, these new BGA heat-sink models are measured under four conditions for thermal resistance. This makes it easier for designers to select the optimal heat sink for their natural convection or forced air cooled system, said CUI Devices.

The BGA heat sinks are made from aluminum with a black anodized finish and offer adhesive mounting styles. Thermal resistances measured at 75°C ΔT in natural convection environments range from 6.41 to 39.1°C/W, while power dissipation ratings range from 1.92 up to 11.69 W at 75°C ΔT in natural convection. Performance curves for full thermal resistance are available in each of the individual part number datasheets.

Prices for the HSB heat sinks start at $0.42 each in quantities of 1,000 through distribution. Lead times is from stock to eight weeks. More information on thermal management including tools such as heat sink and thermal conversion calculators can be found at the company’s resource library.

about CUI Devices