Examining impact of 5G and edge computing on intelligent transportation systems

Update: September 28, 2021

Mouser has released the fifth instalment of the 2021 Empowering Innovation Together (EIT) program. The latest instalment provides deeper insight into the trends encompassing intelligent transportation systems through a highlighted blog, infographic, video and more. The series also incorporates a new episode of The Tech Between Us podcast.

In the latest podcast episode, Raymond Yin, Mouser’s director of Technical Content, speaks with Dr Maxime Flament, CTO of the 5G Automotive Association, about the development of industry safety standards. They investigate the capabilities of implementing 5G networks into transportation systems and the effects of edge computing in the automotive industry. The podcast is also offered on Apple Podcasts, Alexa, Google Podcasts, iHeartRadio, Pandora, Spotify and the company’s own YouTube channel.

“Worldwide, we’re seeing rapidly increasing needs for safe, secure and intelligent transportation systems,” states Glenn Smith, president and CEO of Mouser Electronics. “With new developments enabled by technologies like 5G, ultra-wide bandgap, next-gen wireless connectivity and more, we’re in an era of smart transportation solutions that will change the industry and impact our communities, cities, travel and more.”

The series comprises four byte-sized videos, Then, Now and Next, as well as articles, blogs, infographics and other content, with conversations led by the company’s thought leaders and other experts. Future tech topics following intelligent transportation solutions will evaluate the latest in product technologies such as RF and wireless. The program showcases many new product developments and reveals the technical developments needed to stay timely with new trends in the marketplace.

The fifth instalment of the program is sponsored by the company’s valued partners Amphenol ICC, Amphenol RF, Digi International, Intel, KEMET, Microchip Technology, Molex, STMicroelectronics, TDK and TE Connectivity.