eYs3D Microelectronics raises $7m in Series A funding
eYs3D Microelectronics, a fabless design house targeting computer vision for edge AI, has raised $7 million in Series A funding from strategic partners including: ARM IoT Capital, WI Harper Group and Marubun Corporation.
The funding will allow eYs3D to grow its new product development for AI-based autonomous operation, including robotics, security, touchless control, autonomous vehicles and smart retail.
eYs3D was spun off from Etron Technology in 2016 and this new investment will allow it to build out its embedded chip business in additional markets and bring the startup to the next level. Among the investors ARM will work with eYs3D to focus on the integration of its chips with ARM’s CPU/NPU processors; while WI Harper Group will provide access to its large industrial partners base and ecosystem; and Marubun, a global distributor, joined the funding round to open up new distribution channels for the company.
The computer vision market for AI is critical in enabling autonomous functionalities for software and machines, from robotic spatial awareness to scene understanding of edge devices and, according to Meticulous Research, the 3D and machine vision market is expected to double from $1.35bn in 2020 to $2.65bn in 2027.
eYs3D designs processor ICs for AI at the edge and its technology allows for more sophisticated human/machine coordination. In order to address specific growing markets such as artificial intelligence of things (AIoT) and mobile intelligence, eYs3D uses an innovative silicon design approach with algorithms to integrate and manage information from differing sensor sources including thermal, active 3D sensing and neural network perception.
This “sensor fusion” enables the design of systems for applications incorporating visual simultaneous location and mapping (VSLAM), object feature depth recognition and gesture-based commands.
“With this investment and with high demand for new computer vision capabilities across many sectors, we are well-poised to capture market share as we migrate to full 3D vision depth sensing,” said James Wang, eYs3D’s Chief Strategy Officer. “We are well along our roadmap in the AI-enabling market, and we are excited to continue our journey with our partners and investors that will allow eYs3D to move more computer vision products into the market.”
“As we look to the future, enhanced computer vision support plays a key role in ARM’s AI architecture and deployment,” said Peter Hsieh, Chairman of the ARM IoT Fund. “eYs3D’s innovative 3D computer vision capability can offer the market major benefits, and we are pleased to partner with the company and invest in the creation of more AI-capable vision processors.”