#MBM29SL800BE-90PBT FUJITSU MBM29SL800BE-90PBT New Flash, 512KX16, 90ns, PBGA48, PLASTIC, FBGA-48, MBM29SL800BE-90PBT pictures, MBM29SL800BE-90PBT price, #MBM29SL800BE-90PBT supplier
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Email: sales@shunlongwei.com
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Email: sales@shunlongwei.com
https://www.slw-ele.com/mbm29sl800be-90pbt.html
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Manufacturer Part Number: MBM29SL800BE-90PBT
Pbfree Code: No
Part Life Cycle Code: Obsolete
Ihs Manufacturer: SPANSION INC
Part Package Code: BGA
Package Description: PLASTIC, FBGA-48
Pin Count: 48
ECCN Code: EAR99
HTS Code: 8542.32.00.51
Manufacturer: Spansion
Risk Rank: 5.58
Access Time-Max: 90 ns
Alternate Memory Width: 8
Boot Block: BOTTOM
Command User Interface: YES
Data Polling: YES
Endurance: 100000 Write/Erase Cycles
JESD-30 Code: R-PBGA-B48
JESD-609 Code: e0
Length: 8 mm
Memory Density: 8388608 bit
Memory IC Type: FLASH
Memory Width: 16
Moisture Sensitivity Level: 3
Number of Functions: 1
Number of Sectors/Size: 1,2,1,15
Number of Terminals: 48
Number of Words: 524288 words
Number of Words Code: 512000
Operating Mode: ASYNCHRONOUS
Operating Temperature-Max: 85 °C
Operating Temperature-Min: -40 °C
Organization: 512KX16
Package Body Material: PLASTIC/EPOXY
Package Code: TFBGA
Package Equivalence Code: BGA48,6X8,32
Package Shape: RECTANGULAR
Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial: PARALLEL
Peak Reflow Temperature (Cel): 240
Power Supplies: 1.8 V
Programming voltage: 1.8 V
Qualification Status: Not Qualified
Ready/Busy: YES
Seated Height-Max: 1.2 mm
Sector Size: 16K,8K,32K,64K
Standby Current-Max: 0.000005 A
Subcategory: Flash Memories
Supply Current-Max: 0.025 mA
Supply voltage-Max (Vsup): 1.95 V
Supply voltage-Min (Vsup): 1.65 V
Supply Voltage-Nom (Vsup): 1.8 V
Surface Mount: YES
Technology: CMOS
Temperature Grade: INDUSTRIAL
Terminal Finish: TIN LEAD
Terminal Form: BALL
Terminal Pitch: 0.8 mm
Terminal Position: BOTTOM
Time
Flash, 512KX16, 90ns, PBGA48, PLASTIC, FBGA-48
Pbfree Code: No
Part Life Cycle Code: Obsolete
Ihs Manufacturer: SPANSION INC
Part Package Code: BGA
Package Description: PLASTIC, FBGA-48
Pin Count: 48
ECCN Code: EAR99
HTS Code: 8542.32.00.51
Manufacturer: Spansion
Risk Rank: 5.58
Access Time-Max: 90 ns
Alternate Memory Width: 8
Boot Block: BOTTOM
Command User Interface: YES
Data Polling: YES
Endurance: 100000 Write/Erase Cycles
JESD-30 Code: R-PBGA-B48
JESD-609 Code: e0
Length: 8 mm
Memory Density: 8388608 bit
Memory IC Type: FLASH
Memory Width: 16
Moisture Sensitivity Level: 3
Number of Functions: 1
Number of Sectors/Size: 1,2,1,15
Number of Terminals: 48
Number of Words: 524288 words
Number of Words Code: 512000
Operating Mode: ASYNCHRONOUS
Operating Temperature-Max: 85 °C
Operating Temperature-Min: -40 °C
Organization: 512KX16
Package Body Material: PLASTIC/EPOXY
Package Code: TFBGA
Package Equivalence Code: BGA48,6X8,32
Package Shape: RECTANGULAR
Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial: PARALLEL
Peak Reflow Temperature (Cel): 240
Power Supplies: 1.8 V
Programming voltage: 1.8 V
Qualification Status: Not Qualified
Ready/Busy: YES
Seated Height-Max: 1.2 mm
Sector Size: 16K,8K,32K,64K
Standby Current-Max: 0.000005 A
Subcategory: Flash Memories
Supply Current-Max: 0.025 mA
Supply voltage-Max (Vsup): 1.95 V
Supply voltage-Min (Vsup): 1.65 V
Supply Voltage-Nom (Vsup): 1.8 V
Surface Mount: YES
Technology: CMOS
Temperature Grade: INDUSTRIAL
Terminal Finish: TIN LEAD
Terminal Form: BALL
Terminal Pitch: 0.8 mm
Terminal Position: BOTTOM
Time
Flash, 512KX16, 90ns, PBGA48, PLASTIC, FBGA-48