Master Bond EP5G-80 is a one-component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80C for four hours. This graphite filled compound is not premixed and frozen. It has an unlimited working life at room temperature. It provides electrical conductivity with a volume resistivity of 5-15ohm-cm and a thermal conductivity of 2.88-3.46 W/(m•K) at room temperature.
“EP5G-80 is a speciality non-metallic system designed for heat-sensitive electronic applications where high levels of conductivity are desired. Its key feature is that it does not need elevated heat to fully cure,” says Rohit Ramnath, senior product engineer. “Unlike other graphite filled adhesives, EP5G-80 is a smooth thixotropic paste and can be easily dispensed manually or using automated systems.”
For a conductive system, it offers an exceptionally high Tg of around 130-140C and a tensile modulus that surpasses 1,000,000psi at room temperature. It is serviceable over the temperature range of -50C to +175C and offers a low coefficient of thermal expansion. Ideal for bonding, sealing and coating, it adheres well to a mixture of substrates such as metals, composites, ceramics and many plastics. This formulation provides good lubricity and can be used for static dissipation and EMI/RFI shielding applications. It is black and RoHS compliant. Packaging is provided in syringes, jar and pint containers.
The solution is a one-part, non-premixed and frozen epoxy system utilised for bonding, sealing and coating. This graphite filled system displays high electrical and thermal conductivity and meets NASA low outgassing requirements. It is syringe dispensable, cures at temperatures as low as 80C and offers excellent heat resistance.