ST is the leader in IMUs integrated into smartphones, with 43% of the total smartphones surveyed.
Bosch and Invensense follow, with 22% respectively. These top three manufacturers use different processes and have their own strategies.
The tip 3 accounted for 94% of the IMUs in the sample.
Yole identified different wafer assembly processes such as glass frit, eutectic bonding combined, or not, with fusion bonding.
Growth will be driven by an increasing integration rate of MEMS IMUs in smartphones & wearables.
Moreover, the increasing replacement of stand-alone MEMS accelerometers and gyroscopes with IMUs will contribute to this growth.