“The automotive industry is evolving. With the rapid growth of the EV market and the associated need for more range and performance, the development of electromobility must continue to advance and innovate,” said Peter Schiefer (pictured left) President of the Infineon Automotive Division.
“We are pleased to be working with Infineon and are confident that this collaboration will result in optimized architecture, product performance, cost competitiveness and high system integration to provide customers with the most competitive automotive solutions,” said Jun Seki (pictured right) Foxconn’s EV CSO.
According to the MoU, the two companies will collaborate on the implementation of SiC technology in automotive high-power applications like traction inverters, onboard chargers, and DC-DC converters.
Both parties intend to jointly develop EV solutions based on Infineon’s automotive system understanding, technical support and SiC product offerings combined with Foxconn’s electronics design and manufacturing expertise and the capability of system-level integration.
In addition, the two companies plan to establish a system application centre in Taiwan to further expand the scope of their cooperation.
This centre will focus on optimising vehicle applications, including smart cabin applications, advanced driver assistance systems and autonomous driving applications.
It will also address electromobility applications such as battery management systems and traction inverters.
The collaboration covers a wide range of Infineon’s automotive products, including sensors, microcontrollers, power semiconductors, high-performance memories for specific applications, human machine interface and security solutions.
The system application centre is expected to be established within 2023.
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