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Email: sales@shunlongwei.com
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Features
High voltage
Industrial Standard Package
Thick Al metal die and double stick bonding
Thick copper baseplate
UL E78996 approved
3500VRMS isolating voltage
Benefits
Up to 1600V
Full compatible TO-240AA
High Surge capability
Easy Mounting on heatsink
Al203 DBC insulator
Heatsink grounded
Mechanical Description
The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage
of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.
The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of surface
roughness and improve thermal spread.
The Generation V of AAP module is manufactured without hard mold, eliminating in this way any possible
direct stress on the leads.
The electrical terminals are secured against axial pull-out: they are fixed to the module housing via a click-stop
feature already tested and proved as reliable on other IR modules.
Thermal and Mechanical Specifications
RRM Max. peak reverse leakage 10 mA TJ = 150°C current
VINS RMS isolation voltage 3500 (1 sec) V 50 Hz, circuit to base, all terminals shorted
VFM Max. forward voltage drop 1.45 V IFM = p x IF(AV), TJ = 25°C, tp = 400µs square wave
IF(AV) Max. average forward current 100 A 180° conduction, half sine wave @ Case temperature 100 °C
IF(RMS) Max. RMS forward current 157 A DC @ 90°C case temperarure
TJ Max. junction operating temperature range -40 to 150°C
Tstg Storage temperature range -40 to 150°C
RthJC Max. thermal resistance, junction to case 0.35k/w Per junction, DC operation
Mounting torque ±10% to heatsink 5 N.m
Mass weight 110g
Shunlongwei Inspected Every IRKD91/12A Before Ship, All IRKD91/12A with 6 months warranty.