Lineup expansion of Schottky barrier diodes with 60 V products using the compact US2H package that has excellent heat dissipation allowing easier thermal design : CUHS15F60, CUHS20F60, CUHS15S60, CUHS20S60

Lineup expansion of Schottky barrier diodes with 60 V products using the compact US2H package that has excellent heat dissipation allowing easier thermal design : CUHS15F60, CUHS20F60, CUHS15S60, CUHS20S60

Lineup expansion of Schottky barrier diodes with 60 V products using the compact US2H package that has excellent heat dissipation allowing easier thermal design : CUHS15F60, CUHS20F60, CUHS15S60, CUHS20S60

Notes :
[1] @IF=1.0 A
[2] Rth(j-a)=105 °C/W @Mounted on an FR4 board (25.4 mm×25.4 mm×1.6 mm, Cu Pad : 645 mm2)

Features

  • Low forward voltage :
     Case of CUHS20F60
       VF=0.41 V (typ.) @IF=1.0 A
       VF=0.52 V (typ.) @IF=2.0 A
  • Low reverse current :
     Case of CUHS20F60
       IR=70 μA (max) @VR=60 V
  • Small compact surface mount package :
      High-density mounting secured with US2H package (Package code : SOD-323HE)

Applications

  • Industrial equipment
    Server and network equipment for power supply (Rectification and backflow prevention, etc.)

Product Specifications

(@Ta=25 °C)

Internal Circuit

Lineup expansion of Schottky barrier diodes with 60 V products using the compact US2H package that has excellent heat dissipation allowing easier thermal design : CUHS15F60, CUHS20F60, CUHS15S60, CUHS20S60

Application Circuit Examples

Lineup expansion of Schottky barrier diodes with 60 V products using the compact US2H package that has excellent heat dissipation allowing easier thermal design : CUHS15F60, CUHS20F60, CUHS15S60, CUHS20S60

The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass-production design stage. Providing these application circuit examples does not grant any license for industrial property rights.

Characteristic Curve

Lineup expansion of Schottky barrier diodes with 60 V products using the compact US2H package that has excellent heat dissipation allowing easier thermal design : CUHS15F60, CUHS20F60, CUHS15S60, CUHS20S60

The new products CUHS20S60 and CUHS20F60 have reduced their VF compared with the existing product CUHS10F60, helping to improve efficiency on conductive state.

Notes :
[3] As of October 2020, values measured by Toshiba.

Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.