Magic Information, China’s leading Artificial Intelligence of Things (AIoT) fingerprint-recognition technology provider, has launched a smart-lock reference design, based on AIoT fingerprint recognition running on an STMicroelectronics
This reference design leverages the dual-core (ArmCortex M0+ and M4) advantages of the STM32WB55, designed with high interoperability between the hosting MCU, fingerprint recognition, as well as Bluetooth LE 5.2. The Magic Information fingerprint-recognition algorithm runs on the high-performance STM32WB55 MCU that also enables recognition and unlocks the device in as fast as 0.3 seconds, while ensuring ultra-low power consumption.
“There is increasing demand for locks that offer completely keyless operation. Restrictions such as power consumption, size, and user experience make these locks extremely challenging to deliver,” said Weiwen Yang, CTO of Magic Information, “The combination of Magic Information’s industry-leading technology in embedded fingerprint recognition running on an STM32WB MCU with BLE meets the challenge. Magic Information will offer a turnkey solution for the whole smart-lock industry. Meanwhile, a platform with APIs for various applications is also available to help our clients develop product/business innovations, with outstanding quality and performance assured.”
“With the BLE 5.2 and outstanding processor performance and power efficiency of the STM32WB running Magic Information’s fingerprint recognition, their turnkey reference-design solution integrates compactness in system robustness and performance efficiency. Building on the high-level security of the STM32WB, fingerprint recognition enhances the system-level security for markets where it really matters such as access control and medical devices,” said Arnaud Julienne, Vice President, Head of Marketing and Applications of MDG, IoT/AI Competence Center and Digital Marketing, Asia Pacific Region, STMicroelectronics.
For the best user experience and cost competitiveness, a variety of fingerprint sensors, sizes (including 80×64, 112×88, 176×64, and 160×160), and packaging methods are currently available. The turnkey solution has been qualified with mass productions. At the same time, very much improved efficiency in product building/development can be expected, which can shorten the time-to-market within 20 weekdays.
For more information, visit www.st.com
ELE Timeshttps://www.eletimes.com/author/eletimes-newsUsing Deep Learning Algorithms to Give Bicyclists the ‘Green Wave’ at Traffic Signals
ELE Timeshttps://www.eletimes.com/author/eletimes-newsIndia Innovates Technology That Generates Hydrogen Directly from Agricultural Residue
ELE Timeshttps://www.eletimes.com/author/eletimes-newsStudy Says ‘Blue Hydrogen’ Likely Bad for Climate
ELE Timeshttps://www.eletimes.com/author/eletimes-newsBest of Both Worlds—Combining Classical and Quantum Systems to Meet Supercomputing Demands