As Edge computing devices move towards further miniaturisation, there is a necessity to overcome the limitations associated with smaller form factors. Consequently, Apacer has expanded its DDR4-3200 VLP DIMM series. These low-profile memory modules consolidate compact size with remarkable performance. They are ideal for the still-evolving 5G smart pole industry chain, particularly in the small, component-intensive micro-embedded computers that run netcom, telecommunications and server applications.
The company’s DDR4-3200 industrial VLP DIMM series provides memory modules with the tallest height of just 18.8mm, making them excellent components in miniaturised architectures.
The complete product series comprises VLP RDIMM, VLP ECC UDIMM and VLP UDIMM modules ideal for 1U rack servers, blade servers and netcom and telecommunications equipment. The VLP SODIMM and VLP ECC SODIMM modules are ideal for embedded SBCs such as 1.8” SBC, Pico-ITX, 3.5” SBC, PC/104, EPIC and NUC, as well as embedded computer modules including BOX PC, Qseven, COM Express and COM. Embedded applications such as smart factories, medical devices, defence systems, POS/kiosks, and surveillance systems will gain from these space-conscious options. In response to the specific demands of netcom equipment such as switches, routers, gateways and microservers, the company has also produced a micro memory module series, which comprises VLP Mini EEC UDIMM, VLP Mini RDIMM and VLP SORDIMM form factors.
The DDR4-3200 VLP DIMM series provides capacities up to 32GB. It gives support for Intel’s 11th generation Core processor Rocket Lake-S, Tiger Lake and the 3rd generation Intel Xeon Scalable server processor Ice Lake-SP. For AMD, it supports the latest 3rd generation EPYC server processor Milan.