#MT28F322P3FJ-80BET MICRON MT28F322P3FJ-80BET New Flash, 2MX16, 80ns, PBGA48, FBGA-48, MT28F322P3FJ-80BET pictures, MT28F322P3FJ-80BET price, #MT28F322P3FJ-80BET supplier
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Manufacturer Part Number: MT28F322P3FJ-80BET
Rohs Code: No
Part Life Cycle Code: Obsolete
Ihs Manufacturer: MICRON TECHNOLOGY INC
Part Package Code: BGA
Package Description: FBGA-48
Pin Count: 48
ECCN Code: 3A991.B.1.A
HTS Code: 8542.32.00.51
Manufacturer: Micron Technology Inc
Risk Rank: 5.85
Access Time-Max: 80 ns
JESD-30 Code: R-PBGA-B48
JESD-609 Code: e1
Length: 10 mm
Memory Density: 33554432 bit
Memory IC Type: FLASH
Memory Width: 16
Number of Functions: 1
Number of Terminals: 48
Number of Words: 2097152 words
Number of Words Code: 2000000
Operating Mode: ASYNCHRONOUS
Operating Temperature-Max: 85 °C
Operating Temperature-Min: -40 °C
Organization: 2MX16
Package Body Material: PLASTIC/EPOXY
Package Code: TFBGA
Package Shape: RECTANGULAR
Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial: PARALLEL
Programming voltage: 1.8 V
Qualification Status: Not Qualified
Seated Height-Max: 1.2 mm
Supply voltage-Max (Vsup): 3.6 V
Supply voltage-Min (Vsup): 2.7 V
Supply voltage-Nom (Vsup): 3 V
Surface Mount: YES
Technology: CMOS
Temperature Grade: INDUSTRIAL
Terminal Finish: TIN SILVER COPPER
Terminal Form: BALL
Terminal Pitch: 0.75 mm
Terminal Position: BOTTOM
Width: 7 mm
Flash, 2MX16, 80ns, PBGA48, FBGA-48
Rohs Code: No
Part Life Cycle Code: Obsolete
Ihs Manufacturer: MICRON TECHNOLOGY INC
Part Package Code: BGA
Package Description: FBGA-48
Pin Count: 48
ECCN Code: 3A991.B.1.A
HTS Code: 8542.32.00.51
Manufacturer: Micron Technology Inc
Risk Rank: 5.85
Access Time-Max: 80 ns
JESD-30 Code: R-PBGA-B48
JESD-609 Code: e1
Length: 10 mm
Memory Density: 33554432 bit
Memory IC Type: FLASH
Memory Width: 16
Number of Functions: 1
Number of Terminals: 48
Number of Words: 2097152 words
Number of Words Code: 2000000
Operating Mode: ASYNCHRONOUS
Operating Temperature-Max: 85 °C
Operating Temperature-Min: -40 °C
Organization: 2MX16
Package Body Material: PLASTIC/EPOXY
Package Code: TFBGA
Package Shape: RECTANGULAR
Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial: PARALLEL
Programming voltage: 1.8 V
Qualification Status: Not Qualified
Seated Height-Max: 1.2 mm
Supply voltage-Max (Vsup): 3.6 V
Supply voltage-Min (Vsup): 2.7 V
Supply voltage-Nom (Vsup): 3 V
Surface Mount: YES
Technology: CMOS
Temperature Grade: INDUSTRIAL
Terminal Finish: TIN SILVER COPPER
Terminal Form: BALL
Terminal Pitch: 0.75 mm
Terminal Position: BOTTOM
Width: 7 mm
Flash, 2MX16, 80ns, PBGA48, FBGA-48