Infineon Technologies has launched the automotive-qualified EasyPACK 2B EDT2, a flexible and scalable half-bridge power module. Depending on inverter conditions, this 750V device can reach a maximum power of up to 50kW and 230Arms. With its featured specs, the module is optimised for inverter applications in HEV and EVs.
With the introduction of the EDT2 (Electric Drive Train) technology in this package and full automotive qualification, the company is expanding the application range of the family to incorporate traction inverters. The key feature of the technology is the higher efficiency at low-load conditions. An EDT2 chip assures notably lower losses than current products on the market and even outperforms the company’s previous chip generation by 20%.
Another unique feature of the module is the plug-and-play approach, which simplifies module integration. Also, compared to classic through-hole discrete packages and the HybridPACK 1, soldering of the pins is no longer needed. Infineon’s PressFIT contact technology facilitates a reduction in mounting time. Due to the package size, three EasyPACK 2Bs need 30% less surface area than a HybridPACK 1. For this reason, they provide not only a compact but also a cost-effective design. Furthermore, it is fully qualified to the AQG324 standard.