Nexperia surface-mount device passes Board Level Reliability requirements

Nexperia surface-mount device passes Board Level Reliability requirements

Nexperia surface-mount device passes Board Level Reliability requirements

Nexperia has said that one of its surface-mount device packages – the clip-bond FlatPower package CFP15B – has passed Board Level Reliability (BLR) testing for automotive applications by a leading Tier 1 supplier.

BLR provides a means of evaluating the robustness and reliability of Semiconductor packages and the rigorous testing procedure is especially relevant in automotive applications. Accreditation is seen as being particularly important as the automotive industry shifts towards more electric and connected vehicles, increasing the complexity of onboard electronic systems.

“BLR verification is an important milestone,” said Guido Söhrn, Nexperia’s Product Manager for Power Bipolar Discretes. “The CFP15B represents the latest generation of thermally-enhanced, ultra-thin surface-mount devices. Its versatility and reliability make it suitable for automotive components such as engine control units, transmission control units and many other safety applications such as braking.”

BLR verification confirmed that CFP15B exceeded twice the level of reliability performance that would be expected in accordance with AEC-Q101. Power temperature cycles, combining temperature cycling and intermittent operating life tests, saw the device achieve a qualification of 2,600 cycles.

“The automotive sector presents some tough applications for surface-mount devices, and CFP15B proved itself under the harshest conditions,” added Guido Söhrn.

Manufactured using high-grade materials the CFP15B is able to provide zero delamination in the areas around the leads, die and clip, therefore eliminating moisture ingress and increasing reliability.

The CFP15B’s thermal resistance is reduced by featuring a solid copper clip which optimises the transfer of heat into the PCB, allowing more compact PCB designs. The device is up to 60 per cent smaller than DPAK and SMx packages and increases design flexibility.

The device package is used by different power diode technologies such as Nexperia’s Schottky or recovery rectifiers but can also be extended to Silicon Germanium power diodes or bipolar transistors.