SEMI: 2026 global 300mm semiconductor fab capacity is expected to hit a record high
Mar. 28, 2023 /SemiMedia/ — According to the latest SEMI report, global Semiconductor manufacturers are expected to increase 300mm fab capacity to an all-time high of 9.6 million wafers per month (wpm) in 2026. After strong growth in 2021 and 2022, 300mm capacity expansion is expected to slow this year due to weak demand for memory and logic devices.
“While the pace of the global 300mm fab capacity expansion is moderating, the industry remains squarely focused on growing capacity to meet robust secular demand for semiconductors,” said Ajit Manocha, SEMI President and CEO. “The foundry*, memory and power sectors will be major drivers of the new record capacity increase expected in 2026.”
Chipmakers expected to increase 300mm fab capacity during the 2022 to 2026 forecast period to meet growth in demand include GlobalFoundries, Hua Hong Semiconductor, Infineon, Intel, Kioxia, Micron, Samsung, SK Hynix, SMIC, STMicroelectronics, Texas Instruments, TSMC and UMC. The companies are planning 82 new facilities and lines to start operations from 2023 to 2026.
The SEMI report shows analog and power leading other sectors in capacity growth at a 30% CAGR from 2022 to 2026, followed by foundry at 12%, opto at 6% and memory at 4%.
For more information on the SEMI report, please visit World Fab Forecast | SEMI.