ST announces automotive GaN family

ST announces automotive GaN family

The family combines a monolithic power stage along with drivers and protections in GaN technology as well as System-in-Package (SiP) solutions for application-specific ICs with additional processing and control circuitry.

The Devices use ST’s bond-wire-free packaging technology to provide high robustness, reliability, and performance.

“STi2GaN continues ST’s long success story in compound materials and Smart Power product innovation, targeting mainly automotive applications and the needs of high-density, high-reliability and high-power. Initial offering of STi2GaN solutions suit On-Board Chargers, LiDAR for autonomous driving, bidirectional DC-DC converters, Class-D amplifiers and power conversion systems,” says ST’s Alfio Russo, “the new product family aims to leverage the high-power density and efficiency of GaN to offer an industry-unique range of devices in 100V and 650V clusters that ensure scalability, compactness, and outstanding performance.”