X-FAB enhances automotive embedded flash offering

X-FAB enhances automotive embedded flash offering

X-FAB enhances automotive embedded flash offering

X-FAB Silicon Foundries, the analogue/mixed-signal and specialty Semiconductor solutions foundry, has introduced a new Flash memory capability for its XP018 high-voltage automotive process.

This new Flash IP leverages X-FAB’s proven Silicon Oxide Nitride Oxide Silicon (SONOS) technology, which offers a combination of elevated levels of performance and reliability. Fully compliant with the AEC100-grade 0 automotive specification, it can withstand operation across a -40°C to 175°C temperature range and fully supports the functional safety levels specified by ISO 26262.

It is supplied in a 32 KByte array size, following an 8K x 39-bit configuration, with a 32-bit data bus. A further seven bits are dedicated to Error Code Correction (ECC) so that zero-defect reliability in the field is assured. X-FAB’s proprietary XSTI embedded Non-Volatile Memory (NVM) IP test interface has also been included in order to enable full serial access to the memory.

As this automotive-grade Flash IP is capable of running on a single 1.8 V power supply, it is well-suited for low-power designs. The addition of a built-in-self-test (BIST) module is pivotal in enabling effective memory testing, as well as enabling comprehensive product debugging. X-FAB is also able to provide a full NVM test service to customers if required.

“This new IP solution further enriches X-FAB’s embedded Flash portfolio for 180 nm open technology platforms, which come with a large selection of voltages and wafer materials. This strengthens our offering to the market, allowing us to meet customer demands across a wider variety of applications,” said Thomas Ramsch, Director NVM Development at X-FAB. “It will be of particular value in situations where both low-power and resilience to challenging conditions are expected.”

X-FAB enhances automotive embedded flash offering

“By being able to complement existing X-FAB platforms with new embedded Flash capabilities, our customers will benefit from significant reductions in footprint. Also, the modular approach of XP018 means that fewer mask layers are going to be needed. Both these factors will help with realising major die cost optimisation,” added Nando Basile, Technology Marketing Manager for NVM solutions at X-FAB