MediaTek and AMD are working together to co-engineer Wi-Fi solutions for computing applications. The first collaboration has yielded the AMD RZ600 Series Wi-Fi 6E modules, containing MediaTek’s new ultra-low-power Filogic 330P chipset, for laptops and desktop PCs.
The Filogic 330P chipset will power AMD’s Ryzen series laptop and desktop PCs in 2022 and beyond, claiming fast Wi-Fi speeds with low latency and less interference from other signals.
The collaboration is all about delivering a fast and reliable wireless connectivity to meet consumer demand for speed, bandwidth, and performance. The companies developed and certified PCIe and USB interfaces for modern sleep states and power management to optimize the AMD RZ600 Series Wi-Fi 6E modules. Further optimization included stress testing and ensuring compatibility standards, which will help reduce the development time for OEM customers, said MediaTek.
“Having fast and reliable wireless connectivity is crucial, especially as consumers’ speed, bandwidth and performance demands rise due to increased video calling, streaming and gaming,” said Saeid Moshkelani, senior vice president and general manager, client business unit, AMD, in the announcement. “We believe that combining powerful AMD Ryzen processors with MediaTek’s leadership advanced connectivity technologies will deliver an all-around incredible computing experience.”
The partnership also expands MediaTek’s share in the PC market. “MediaTek is already the Wi-Fi leader in a number of different segments, including smart TVs, routers and voice assistants. The new Filogic 330P chipset further broadens our connectivity portfolio as we continue to expand our footprint in the PC market,” commented Alan Hsu, corporate vice president and general manager, Intelligent Connectivity at MediaTek, in the announcement.
MediaTek recently unveiled its Filogic connectivity family with the launch of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) and Filogic 630 Wi-Fi 6E network interface card (NIC) solutions. These devices target routers, access points and mesh systems.
The company also offers the Filogic 130 and 130A SoCs for IoT devices. Both SoCs integrate a microprocessor, AI engine, Wi-Fi 6, Bluetooth 5.2 subsystems, and a power management unit. The Filogic 130A also integrates an audio digital signal processor.
The new Filogic 330P supports the latest connectivity standards of 2×2 Wi-Fi 6 (2.4/5 GHz) and 6E (6 GHz band up to 7.125 GHz), along with Bluetooth 5.2 (BT/BLE). The high throughput chipset supports up to 2.4-Gbits/s connectivity, including support for the new 6-GHz spectrum at 160-MHz channel bandwidth. The chipset also integrates MediaTek’s power amplifier (PA) and low noise amplifier (LNA) technology to help optimize power consumption and reduce design footprint. This enables the Filogic 330P chipset to be embedded in laptops of all sizes, said MediaTek.
The AMD RZ600 Series Wi-Fi 6E modules expand AMD’s Wi-Fi capabilities. The modules are available in two options. The RZ616 offers 160-MHz Wi-Fi channels and a PHY rate up to 2.4 Gbit/s while the RZ608 delivers 80-MHz Wi-Fi channels and a PHY rate up to 1.2 Gbits/s.