Production is due to start in H2 2028.
“We are excited to become the first in the industry to build a state-of-the-art advanced packaging facility for AI products in the United States that will help strengthen supply chain resilience and develop a local semiconductor ecosystem,” says Hynix CEO Kwak Noh-Jung.M, “we believe this project will lay the foundation for a new Silicon Heartland, a semiconductor ecosystem centered in the Midwest Triangle. This facility will create local, high-paying jobs and produce AI memory chips with unmatched capabilities, so that America can onshore more of its critical chip supply chain. We are grateful for the support of Gov. Holcomb and the state of Indiana, of President Chiang at Purdue University, and of the broader community involved, and we look forward to expanding our partnership in the long run.”
No reference has been made to any Chips Act money that might have persuaded Hynix to make the investment.
Hynix has about 50% of the HBM market having pioneered the architecture with AMD ten years ago to facilitate the gaming market.
HBM then turned out to be the best memory to use with GPUs for AI training and inference