The Open Domain-Specific Architecture (ODSA) is a project within the Open Compute Project (OCP) community to establish open physical and logical die-to-die (D2D) interfaces for chiplets. The goal is to democratize the design and use of chiplets for domain-specific high-performance computing (HPC) applications like generative artificial intelligence (AI). Domain-specific architectures (DSAs) are an emerging approach […]
March 18, 2024 — TDK Corporation recently announced the expansion of its Micronas 3D HAL® position sensor family with the launch of the HAR 3920-2100, a new dual-chip sensor for automotive and industrial applications. It was designed to meet the demand for highly accurate both linear and angular position measurements in the presence of disturbing […]
Here, in our series on the latest EW BrightSparks of 2023, we profile Lewis Thom, a Design Engineer at GB Electronics. Achievements His manager who nominated him – a former EW BrightSparks winner himself, from 2017, Alex Croucher – hailed him as someone who has “excelled in his four years at GB Electronics”: Lewis’s “hard work, […]
This programme supports the delivery of a universal fault-tolerant quantum computer demonstrator with 128 logical qubits by 2030 and its industrialization into a 2048-logical-qubits computer by 2035. The PROQCIMA programme is one part of the €1 billion French National Strategy for Quantum. The selected companies: Alice & Bob, PASQAL, Quandela, C12 and Quobly will have […]
This design for analog chips, which marries the precision of digital systems with the speed and energy efficiency of analog technology, holds promise for transforming data processing in autonomous vehicles, AI, and beyond. Researchers at the USC Viterbi School of Engineering have made a significant advancement in analog computing, potentially revolutionising the way data is […]
The partnership emphasizes the critical importance of aligning all system components, energy harvesting, power management and storage, to ensure optimal system performance. Recognizing that the efficiency of a system cannot be judged by its individual parts alone, the focus is on the combined operation of all elements. By combining e-peas’ specialized knowledge in PMICs with […]
Chiplets are here, and more are coming. They can overcome the yield limitations of large ASICs, support a mix-and-match strategy for heterogeneous semiconductor IPs and multiple process nodes, improve thermal performance, and speed time to market. They are being used in a range of high-performance computing (HPC) applications, notably generative artificial intelligence (AI) and machine […]
Claimed density is “over 130W/in3 with efficiency over 97%. The architecture replaces the standard four diode bridge (and boost power factor correction) at the front end with an active all-transistor circuit – a multi-phase totem pole power factor corrector. While often called ‘bridgeless’ because it has done away with the four diodes, this architecture uses […]
Things to Know: CHD is a leading cause of morbidity and mortality in infants, with early detection being crucial for effective treatment and increased survival rates. Traditional diagnostic methods are complex and inaccessible in many regions, highlighting the need for simpler, more affordable solutions like paediatric ECGs. Recent studies, such as the CHDdECG model, demonstrate […]