New SBC with high-performance processor for industrial applications
DFI has launched its PCSF51 next-generation 1.8″ Single Board Computer at Embedded World 2023. The 1.8″ SBC powered by the AMD Ryzen Embedded R2000 Processor, the SBC supplies advanced graphics processing and computing abilities in a small form factor. Provided with flexible expandability and I/O versatility, this energy-efficient SBC is aimed at industrial applications, robotics, edge computing, AI vision systems, and more.
“By leveraging the latest AMD Ryzen Embedded R2000 Processor, we have achieved many advantages for the tiny yet powerful PCSF51,” said DFI president Alexander Su. “We have a positive outlook for future Industrial Pi innovations.”
Compared to its earlier generation GHF51 with the AMD Ryzen R1000 Processor, the latest R2000 processor built into the device delivers upgraded performance with double the max CPU core count, scalability of up to four CPU cores and eight threads, and a 50% boost in CPU power. Graphics performance increases by 15% with up to eight graphic compute units. The device’s design has also been improved from the previous GHF51, with a simpler-to-use onboard power/reset, HDMI, and a thinner thermal module. With rich multimedia capabilities, it can support ultra-high-resolution displays in 4K resolution.
The SBC provides excellent scalability with robust expansion ports to accommodate a wide range of I/O interfaces, including HDMI, USB 3.1, and Gigabit Ethernet connectivity. Its CPU offers a selection of 4GB or 8GB of single-channel DDR4 memory down and eMMC storage capacities of up to 128GB. Outstanding graphics processing and computing horsepower incorporated with low power consumption and low thermal design power make the compact SBC excellent for mission-critical or space-limited applications, including machine learning, in-vehicle infotainment, and industrial automation. Its next-generation Industrial Pi is the improved successor of Pi SBC that satisfies the requirements of IIoT with greater performance and durability and opens up new application possibilities.