January 8, 2024 — According to reports, Nvidia and AMD will continue to expand the artificial intelligence (AI) market in 2024, and it is expected that the two companies will place orders for approximately 1.5 million advanced AI chips from TSMC.
The report pointed out that Nvidia will release new products such as B100 and GB200 of the next generation architecture in 2024. AMD’s main AI accelerators include MI300A, MI300X, etc. With the support of TSMC’s production capacity, AMD’s annual shipment momentum of AI acceleration chips is expected to reach 600,000 units in 2024.
In response to the strong demand for advanced packaging from Nvidia and AMD, TSMC will continue to expand its advanced packaging production capacity such as CoWoS. Therefore, manufacturers of advanced chip packaging equipment are expected to see shipment momentum increase quarter by quarter in 2024.