Key Things to Know: RISC-V’s Growth: Since its introduction, RISC-V has rapidly become one of the three major processor architectures, highlighted by significant adoption in China and innovations like Alibaba’s open-source laptop. Early Challenges: Initially, RISC-V faced hurdles such as limited industry awareness, lack of a robust ecosystem, and competition from established architectures like Intel […]
April 16, 2024 — Microchip Technology recently announced the acquisition of Neuronix AI Labs to expand its capabilities in energy-efficient, AI-enabled edge solutions deployed on field-programmable gate arrays (FPGAs). Neuronix AI Labs provides neural network sparsity optimization technology that enables a reduction in power, size and calculations for tasks such as image classification, object detection […]
Key Things to Know: Challenging NVIDIA’s Dominance: Intel introduces the Gaudi 3 AI accelerator, aiming to offer a robust alternative to NVIDIA’s GPUs, enhancing competition in the AI silicon market. Technological Advancements: Intel’s Gaudi 3, crafted with TSMC’s advanced 5-nanometer technology, offers substantial enhancements in performance, delivering 1835 TFLOPS of FP8 compute throughput. Market Dynamics: […]
5G brought architecture changes that require synchronization. Depending on the location and network site, those timing requirements require different PTP profiles and PTP capacity. As critical infrastructure such as telecommunications, utilities, transportation, and defense migrate from 4G to 5G, you might assume that these essential services universally adopt the ITU-T G.8275.1 Precision Time Protocol (PTP) […]
Concurrent Technologies has put Intel Atom x7000RE Amston Lake processors into a VME board, adding image processing and AI audio processing accelerators to the venerable form factor. CPU choice on the board, called Rhea, is either the four-core 1.5GHz x7433RE, or the two-core 2GHz x7213RE. “Whilst no longer the cutting edge of technology, VME continues […]
Chiplets enable heterogeneous integration of various process nodes and materials to maximize performance. UCIe is a new die-to-die interconnect standard for high-bandwidth, low-latency, power-efficient, and cost-effective connectivity between chiplets. UCIe is also the first specification to include an interface that is compatible with optical links. Large computing systems needed to support high-performance computing (HPC) applications […]
Hardware isolation and virtualisation are provided to allow sharing of on-die hardware between different code blocks without interaction “to support the consolidation of cross-vehicle electronic control units in vehicle central compute applications”, said NXP. “Vehicle functions can be independently managed, including fault handling and reset. They can receive independent software over-the-air updates, which is a […]
The event covers automotive, military, telecoms, industrial and consumer electronics sectors. For all our coverage, simply bookmark: www.electronicsweekly.com/tag/embedded-world/ Embedded World 2024 Embedded World: Cortex-M33 Wireless MCUs for Bluetooth LE and Matter Silicon Labs announces an Arm Cortex-M33 based family of secured wireless microcontrollers covering Matter, OpenThread, Zigbee and Bluetooth LE. Called xG26, it consists of […]
The Advantech Industrial IoT team will showcase through live demos at Embedded World 2024 how its collaboration with Microsoft uses Microsoft Azure cloud services to provide solution-ready packages that maximise user experience. Advantech IIoT and Microsoft: Pioneering Industrial Digital Transformation As a Microsoft Global Cloud Solution Provider, Windows Embedded/IoT distributor and Gold Cloud Platform Partner, Advantech IIoT is able to use […]