Key Things to Know: Innovative Ingestible Sensor: Researchers have developed a new ingestible capsule equipped with microfabricated, flexible, wireless pressure sensors that provide detailed insights into gastrointestinal motility, surpassing traditional diagnostic methods. Enhanced Diagnostic Capabilities: The capsule measures both contractile movements and intraluminal pressures within the digestive tract, offering a comprehensive view of gastrointestinal health […]
“This announcement will unleash over $40 billion in investment from Samsung, and cement central Texas’s role as a state-of-the-art semiconductor ecosystem, creating at least 21,500 jobs and leveraging up to $40 million in CHIPS funding to train and develop the local workforce,” said President Joe Biden. In addition to the proposed direct funding of up […]
On April 3, 2024, a 7.2-magnitude earthquake struck eastern Taiwan before 8:00 a.m. local time. This was the strongest earthquake to hit Taiwan in 25 years, leading to evacuations of numerous buildings that were in danger of collapsing. Taiwan is central in end wafer production and backend assembly and testing processes, producing over 60% of […]
Chiplets enable heterogeneous integration of various process nodes and materials to maximize performance. UCIe is a new die-to-die interconnect standard for high-bandwidth, low-latency, power-efficient, and cost-effective connectivity between chiplets. UCIe is also the first specification to include an interface that is compatible with optical links. Large computing systems needed to support high-performance computing (HPC) applications […]
April 11, 2024 — According to industry insiders, Micron plans to increase the prices of its DRAM and SSD products by more than 25% in the second quarter of 2024. Sources pointed out that after the earthquake in Taiwan region on April 3, Micron, SK Hynix, and Samsung successively suspended quotations for memory chips. Although […]
April 10, 2024 — According to reports, the U.S. federal government will provide TSMC with a US$6.6 billion grant subsidy. Under this support, TSMC agreed to increase its investment in the United States by more than 60% from US$40 billion to more than US$65 billion. In addition, TSMC will also produce the world’s most advanced […]
“These are intriguing times,” he said. The announcement of Blackwell makes for interesting conversation around scale. Blackwell and the DGX generation 2 system probably won’t be generally available for quite some time. So it makes for an interesting acquisition strategy: ‘Do I acquire the Hopper base system – the H1o0, Bluefield etc – today and […]
TSMC is to build a third fab in Arizona and will manufacture 2nm ICs in the US starting in 2030. “For the first time ever, we will be making, at scale, the most advanced semiconductor chips on the planet here in the United States of America,” said US Commerce Secretary Gina Rainindo, overlooking the fact […]
In 2021, Samsung announced a $17 billion investment in Taylor for its first fab in the city. This week’s investment is said to be $20 billion for a second fab and $4 billion for a packaging plant plus increased R&D capabilities. Taylor 2 is expected to focus on HBM. DRAM producers are estimated by TrendForce […]