Key Features include:
- Read / write speed improvement over previous
- Package size reduction over previous generation[5: Package size is 9mmx13mm and package thickness is 0.8mm (256GB and 512GB) and 0.9mm (1TB), resulting in an approx. 18% reduction compared to conventional package size (11mmx13mm).
The UFS Ver. 4.0 devices integrate the company’s BiCS FLASH™ 3D flash memory and a controller in a JEDEC standard package. UFS 4.0 incorporates MIPI M-PHY 5.0 and UniPro 2.0 and supports theoretical interface speeds of up to 23.2 gigabits per second (Gbps) per lane or 46.4 Gbps per device. UFS 4.0 is backward compatible with UFS 3.1.
Sample shipments for the 256 and 512GB products begin this month, with the 1TB offering following in June 2024.