Nexperia shrinks packages for standard logic devices

Nexperia has claimed the smallest and lowest profile 14-, 16-, 20-, and 24-pin packages for standard logic devices, enabling these devices to be used in space-sensitive applications such as smartwatches, mobile devices, and connected industrial devices. The 16-pin DHXQFN package, as an example, is 45% smaller than the industry-standard DQFN16 leadless device. The new package also offers a 25% saving in PCB area, compared with competitive packages, said the company.

The standard logic packages measure 2 × 2 mm (14 pin), 2 × 2.4 mm (16 pin), 2 × 3.2 mm (20 pin), and 2 × 4 mm (24 pin), with a 0.4-mm pitch and 0.45-mm height. Standard logic devices include hex inverting Schmitt-triggers, 8-bit SIPO shift registers with output latches, 4-bit dual supply translating transceivers, octal buffer/line drivers, octal bus transceivers, and 8-bit dual supply translating transceivers.

The small footprint of the DHXQFN package also enables devices to be placed closer to the bypass capacitor. “This can be a significant advantage in designs with limited board space for glue logic parts, and also results in increased performance in high frequency applications since the traces between logic device and capacitor are shorter,” said Nexperia.

Earlier this year, Nexperia introduced 40-V power mosfets in a high-reliability LFPAK88 package for automotive (BUK7S0R5-40H) and industrial (PSMNR55-40SSH) applications. These devices are said to offer power densities more than 50× greater than traditional D2PAK devices.

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