According to reports citing industry sources, mainland China’s Semiconductor packaging and testing service providers such as JCET, Tongfu Microelectronics, and Huatian Technology are working to improve QFN (Quad Flat No-leads Package) packaging capabilities for automotive chips.
QFN packaging is cost-effective and can be used to replace BGA and QFP packaging. It is becoming a key technology for packaging automotive chips and other mature chips.
The report pointed out that the QFN technology of JCET has been verified to be used in the motion sensors for vehicle safety system and driving stability test system, and is currently in mass production.