Called SiZF4800LDT, the “device provides designers with a space-saving solution for synchronous buck converters, point-of-load converters, and half-bridge and full-bridge power stages,” according to New Yorker. “In these applications, the high and low side mosfets form an optimised combination for 50% duty cycles, while its logic level turn-on at 4.5 V simplifies circuit driving.” Maximum […]
Chiplet testing begins with performance simulations during the design process. Compared with monolithic devices, heterogeneous chiplets require more complex testing, including known good die (KGD) testing, final test, and system level test. Success also depends on the implementation of design for test (DfT) based on several IEEE standards. Chiplet designers need high-speed tools that can […]
Cheese byproduct converts electronic waste into gold. Key Things to Know: The global e-waste problem is escalating, with millions of metric tonnes generated annually, necessitating innovative recycling solutions. Researchers have developed a groundbreaking method using cheese byproduct whey protein to efficiently extract gold from electronic waste. This new technique not only promises to reduce environmental […]
Generative artificial intelligence (AI) requires rapid and continuous movement of large amounts of data. In a growing number of instances, electrical input/output (I/O) connections between the ICs in chiplets are becoming a bottleneck to higher performance. Key electrical I/O performance barriers include power efficiency, bandwidth, and latency. This FAQ looks at the anticipated benefits of […]
“They are suitable for processing in fully automated processes, such as for the particularly dense, double-sided assembly of PCBs,” it said. They are available “in blister or tape and reel packaging for automated processing”. Versions with 4, 6 and 8 contacts and with different codings are being offered, in both shielded and unshielded versions. There […]
Called Series 144, they feature sputtered ruthenium contacts so they can switch at high power and low-level signals. There is also an internal mu-metal screen to eliminate magnetic interaction between closely stacked devices. Maximum carry current is 3A in all cases, while some witll stand-off 2kV and others 3kV. Max switching is 80W 1A, or […]
The package, SSO10T, has a 10μm gap instead of a thermal pad on the PCB side, and around 95% of heat will leave through the top, according to the company, typically to the ECU housing or a cold-plate. It is expected to be used with a thermal interface pad to accommodate tolerance between PCB and […]
March 25, 2024 — Diodes Incorporated recently introduced three new Hall effect switches, the AH1899A/B/S, which operate with low supply voltages and very low quiescent current to extend battery life in mobile and portable devices.The AH1899A/B/S are used to detect the open/closed status of covers and cases for portable electronic devices, such as smartphones and […]
Key Things to Kow: Mass Production Evolution: The transition from through-hole to surface mount technology has significantly reduced the size and cost of electronics, enabling mass production and global distribution. Environmental and Ethical Concerns: The electronics industry faces challenges related to e-waste, environmental damage from raw material extraction, and ethical issues in manufacturing locations. Localised […]