Bosch announces acquisition of TSI Semiconductors
Apr. 28, 2023 /SemiMedia/ — Bosch has announced the acquisition of the assets of Roseville, California-based chipmaker TSI Semiconductor. With this planned acquisition, Bosch will significantly expand its global silicon carbide semiconductor product portfolio by the end of 2030.
TSI is a foundry that produces application-specific integrated circuits (ASICs). It primarily develops and produces chips on 200mm silicon wafers for industries such as mobile, telecommunications, energy and life sciences.
Upon completion of the acquisition, Bosch plans to invest more than $1.5 billion in the plant and transform TSI Semiconductor’s production facilities to state-of-the-art processes. Starting in 2026, the first chips will be produced on 200mm wafers based on the innovative material silicon carbide.
In this way, Bosch is systematically strengthening its semiconductor business and will significantly expand its global silicon carbide chip portfolio by the end of 2030.
“The acquisition of TSI Semiconductor allows us to establish silicon carbide chip manufacturing capabilities in a significant sales market, while also expanding our semiconductor manufacturing operations globally. The existing cleanroom facility and professional staff in Roseville will allow us to expand silicon carbide chips for e-mobility at scale,” said Dr. Stefan Hartung, Chairman of the Board of Management of Bosch.
“We are excited to join a global operating technology company with broad expertise in the semiconductor industry. We believe that the Roseville facility will have a significant impact on Bosch’s silicon carbide chip manufacturing business,” said Oded Tal, CEO of TSI Semiconductor.
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