Call for research papers for DVCon Europe’s 10th anniversary
This year, the event will include a research track and authors from universities and research institutes are invited to contribute research papers for consideration. Successful submissions going on to be published as academic papers.
The organiser is encouraging papers, tutorials or panel discussion suggestions around digital twins, the IoT, functional safety and security, machine learning / AI, RISC-V and digitalisation themes.
Proposals for engineering papers, tutorials and panels must be received by 01 May. The deadline for the initial submission of research papers is Monday 17 July. Full papers for all tracks are due on Monday 28 August.
DVCon Europe is a conference and exhibition to showcase EDA and IP solutions and services. The conference topics cover the application of languages, tools and intellectual property for the design and verification of electronic systems and ICs. The event for chip architects, design and verification engineers and IP integrators is a platform to discuss and demonstrate methodologies, techniques, applications and demonstrations of EDA for electronic design. It is sponsored by Accellera Systems Initiative and part of international DVCon events in Japan (June), India (September) and the USA.
Martin Barnasconi, general chair of the conference and steering committee, wants to expand the DVCon Europe design and verification community. said, “ We are looking forward to partnering with universities and research institutes to broaden our perspective and to facilitate a forum where academia can engage with industry. We anticipate a rich technical program covering both engineering as well as research papers, along with compelling keynotes, in-depth tutorials and energetic panels”.
The DVCon Europe 2023 steering committee is composed of technical experts from NXP, Intel, Bosch, ARM, Infineon and Qualcomm. An additional technical programme committee has been formed , made up of industry and academic experts, and will review and select the engineering and academic papers.
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