Samsung is said to be building a packaging test plant in Japan
Apr. 3, 2023 /SemiMedia/ — According to industry insiders, Samsung is considering establishing a chip packaging and testing production line in Japan to strengthen its advanced packaging business and establish closer ties with Japanese Semiconductor material equipment manufacturers.
The source pointed out that the address of Samsung’s packaging and testing plant may be selected in Kanagawa Prefecture, Japan, because there is already a research and development center there. Although details such as timing have not been confirmed, the investment is likely to be in the tens of billions of yen (about $75 million).
Samsung is seeking to deepen its relationship with Japanese companies, where there are leading manufacturers of chip equipment and materials, which will help Samsung enter the local ecosystem.