SEMI announced in its latest 200mm Fab Outlook Report that from 2020 to 2024, global Semiconductor manufacturers are expected to increase the capacity of 200mm wafer fabs by 950,000 wafers, or 17%, to a record high of 6.6 million wafers per month.
The report also pointed out that 200mm fab equipment spending is expected to reach nearly $4 billion in 2021 after passing the $3 billion mark in 2020 and hovering between $2 billion and $3 billion from 2012 to 2019. The spending increase reflects in part the global Semiconductor industry’s push to overcome the current chip shortage with 200mm fab utilization continuing at high levels.
“The 200mm Fab Outlook Report shows that, during the same period, wafer manufacturers will add 22 new 200mm fabs to help meet growing demand for 5G, automotive and Internet of Things (IoT) devices that rely on analog, power management and display driver integrated circuits (ICs), mosfets, microcontroller units (MCUs) and sensors,” said Ajit Manocha, SEMI president and CEO.
The report also reveals that foundries will account for more than 50% of fab capacity worldwide this year, followed by analog at 17% and discrete/power at 10%. Regionally, mainland China will lead the world in 200mm capacity with 18% share in 2021, followed by Japan and Taiwan region at 16% each.
Equipment investments are projected to remain above $3 billion in 2022, with the foundry sector accounting for more than half of the spending, followed by discrete/power at 21%, analog at 15%, and MEMS and sensors at 7%.
The SEMI 200mm Fab Outlook Report reflects 365 updates across 146 facilities and lines since the most recent update of the report in 2019. The report includes details on more 300 200mm fabs and lines. To purchase the report, please visit https://www.semi.org/en/products-services/market-data/200mm-fab-outlook.