Chinese OSAT players gain momentum as global packaging market grows 3% in 2024

June 2, 2025 — The global outsourced semiconductor assembly and test (OSAT) market reached $41.56 billion in total revenue in 2024, marking a 3% year-on-year increase, according to the latest TrendForce report. ASE Technology retained its leadership with $18.54 billion, nearly 45% of the top ten’s combined revenue. Amkor came in second with $6.32 billion, down 2.8% from 2023.

China’s OSAT companies continued their rapid rise. JCET reported $5 billion in revenue, a 19.3% increase, placing third globally. Tianshui Huatian ranked sixth with $2.01 billion, growing 26% year-over-year—the fastest among the top ten.

Analysts attribute this growth to strong state support, rising domestic electronics demand, and accelerated technology upgrades through mergers and acquisitions. The rise of mainland Chinese players is increasing pricing pressure on Taiwanese companies, especially in mid- to low-end packaging services.

Looking ahead to 2025, the global OSAT market is forecast to expand by 8%, driven by surging demand for AI applications. Companies including ASE’s SPIL unit, Amkor, and KYEC are ramping up CoWoS-related capacity. The semiconductor supply chain is entering a new growth phase, where advanced nodes and packaging technologies are gaining traction, while traditional markets also begin to recover, opening new avenues for industry development.