RENESAS HM62G36256ABP30 In-Stock

Renovatio: March 6, 2024 Tags:icTechnology

#HM62G36256ABP30 RENESAS HM62G36256ABP30 Novum Late-Scribe SRAM, 256KX36, 1.7ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PIX, BGA-119, HM62G36256ABP30 imagines, HM62G36256ABP30 pretium, #HM62G36256ABP30 elit.
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Manufacturer Pars Number: HM62G36256ABP-30
Pars Vita Cycle Code: Transferred
Ihi Manufacturer: HITACHI LTD
Pars Package Code: BGA
Sarcina Description: BGA, BGA119,7X17,50
Pin Count: V
ECCN Code: 3A991.B.2.A
HTS Code: 8542.32.00.41
Manufacturer: Hitachi Ltd
Risk Rank: 5.64
Access Time-Max: 1.7 ns
I / O Type: COMMUNE
JESD-30 Codex: R-PBGA-B119
Longitudo: CXCV mm
Memoria Density: 9437184 bit
Memoria IC Typus: SERO-WRITE SRAM
Memoria Latitudo: 36
Numerus functionum: 1
Numerus terminales: VII
Numero Verborum: 262144 words
Numerus verborum Code: 256000
Modus operating: SYNCHRONUS
Temperature operating-Max CL ° F
Organization: 256KX36
Output Characteres: III-STATU
Sarcina Corpus Material: Plastic / EPOXY
Sarcina Code: BGA
Sarcina Equivalence Code: BGA119,7X17,50
Figura autem sarcina: ORTHOGONIUS
Sarcina Style: GRID ACIES
Parallel/Serial: PARALLEL
Potentia commeatus: 2.5,3.3 V
Status absolute, non secundum quid
Sedet Altitudo-Max: 2.24 mm
Standby Current-Max: 0.1 A
sto voltage-Min: D V
Subcategoria: SRAMs
Supple Current-Max: 0.6 mA
Supple voltage-Max (Vsup): 2.63 V
Supple voltage-Min (Vsup): 2.38 V
Supple voltage-Nom (Vsup): XII V
Superficiem monte: ETIAM
Technology: CMOS
Temperature Grade: COMMERCIUM
Terminatio forma: BALL
Terminatio Pix: 1.27 mm
Terminatio Position: SOLUM
Width: XXXV mm
Nuper Scribe SRAM, 256KX36, 1.7ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119