RENESAS HM62G36256ABP30 In-Stock

RENESAS HM62G36256ABP30 In-Stock

#HM62G36256ABP30 RENESAS HM62G36256ABP30 New Late-Write SRAM, 256KX36, 1.7ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119, HM62G36256ABP30 pictures, HM62G36256ABP30 price, #HM62G36256ABP30 supplier
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Manufacturer Part Number: HM62G36256ABP-30
Part Life Cycle Code: Transferred
Ihs Manufacturer: HITACHI LTD
Part Package Code: BGA
Package Description: BGA, BGA119,7X17,50
Pin Count: 119
ECCN Code: 3A991.B.2.A
HTS Code: 8542.32.00.41
Manufacturer: Hitachi Ltd
Risk Rank: 5.64
Access Time-Max: 1.7 ns
I/O Type: COMMON
JESD-30 Code: R-PBGA-B119
Length: 22 mm
Memory Density: 9437184 bit
Memory IC Type: LATE-WRITE SRAM
Memory Width: 36
Number of Functions: 1
Number of Terminals: 119
Number of Words: 262144 words
Number of Words Code: 256000
Operating Mode: SYNCHRONOUS
Operating Temperature-Max: 70 °C
Organization: 256KX36
Output Characteristics: 3-STATE
Package Body Material: PLASTIC/EPOXY
Package Code: BGA
Package Equivalence Code: BGA119,7X17,50
Package Shape: RECTANGULAR
Package Style: GRID ARRAY
Parallel/Serial: PARALLEL
Power Supplies: 2.5,3.3 V
Qualification Status: Not Qualified
Seated Height-Max: 2.24 mm
Standby Current-Max: 0.1 A
Standby voltage-Min: 3.14 V
Subcategory: SRAMs
Supply Current-Max: 0.6 mA
Supply Voltage-Max (Vsup): 2.63 V
Supply Voltage-Min (Vsup): 2.38 V
Supply Voltage-Nom (Vsup): 2.5 V
Surface Mount: YES
Technology: CMOS
Temperature Grade: COMMERCIAL
Terminal Form: BALL
Terminal Pitch: 1.27 mm
Terminal Position: BOTTOM
Width: 14 mm
Late-Write SRAM, 256KX36, 1.7ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119