TI and NVIDIA collaborate on 800V power architecture for next-gen AI data centers

May 29, 2025 — Texas Instruments (TI) announced it is partnering with NVIDIA to develop power management and sensing solutions tailored for 800V high-voltage DC (HVDC) power distribution in AI data centers. The collaboration aims to deliver scalable, high-efficiency power architectures to meet the surging demand driven by AI workloads.

Power requirements per rack are rapidly climbing—from 100kW today to over 1MW in the near future. Traditional 48V systems can’t scale efficiently, requiring massive amounts of copper and presenting physical and thermal limitations. By contrast, the 800V HVDC architecture significantly increases power density while reducing system size and complexity.

“This marks a fundamental shift in data center design,” said Jeffrey Morroni, Director of Power Management R&D at TI’s Kilby Labs. “AI is rewriting the rules of power. TI’s deep experience in high-efficiency power conversion, combined with NVIDIA’s leadership in AI, is enabling an entirely new generation of data center infrastructure.”

Gabriele Gorla, NVIDIA’s Vice President of System Engineering, added: “Semiconductor-based power systems are critical to unlocking the full performance potential of AI data centers. Our collaboration with TI supports the development of efficient 800V architectures designed for future-ready AI compute environments.”