Pro iis qui salire volunt ad discendum de 67th annui IEDM, ad 11-15 Decembris, 2021 ad Capulum San Francisco Unionis Quadrati deversorium sub themate "Devices pro nova electronicorum periodo: Ex 2D Materiis ad 3D Architecturas ,” Haec dimissio nuntium praebet harum institutionum oblationum descriptiones.
Tutoriales et breves cursus providebunt attendees cum scientia inaestimabili et informatione necessaria ad statum-of-the-art promovendum.
IEDM Tutorials - Sabbato, 11 Dec
Iam in duodecimo anno, Saturni 12-minute sessiones paedagogiae in technologiarum emergentes et argumenta specialia facta sunt in parte IEDM valde popularis. A peritis in respectivis areis exhibentur, propositum esse pontis spacium inter cognitionis gradus vestigationis et investigationis currentis aciem ducens. Argumenta pro 90 sunt:
2: 45 post meridiem - 4: 15 post meridiem
• Vltra FinFET Era: Provocationes et facultates pro CMOS Technology, Kai Zhao, IBM
• TCAD-Substructio DTCO et STCO, Asen Asenov, Universitas Glasguensis
• 6G Technologia provocat a machinis ad systemata Wireless, Aarno Pärssinen, Oulu.
University
4: 30 post meridiem - 6: 00 post meridiem
• electionem selectivam et processuum atomi-Scale pro Advanced Gallium Vestibulum, Robert Clark, TEL
• Machina Learning for Gallium et fabrica circuit Exemplar, Elyse Rosenbaum, University Illinois, Urbana-Champaign
• GaN Power Fabrica Technology et Reliability, Dong Seup Lee, Texas Instrumenta
IEDM cursus breves – Dominica, die 12 Dec
Contra Tutoriales, dies plenae IEDM cursus Solis breves in uno technico argumento notantur. Adnotatione commendatur Apollonii, ut saepe e venditur. Occasionem cognoscendi de areis et incrementis et retis global peritis offerunt.
• Future Scaling and Integration Technology, organizata a Dechao Guo, IBM Research
o Processus et Materias Engineering Innovationes pro Advanced Logica Transistor Scaling,
Beniamin Colombeau, Acta Materiae
o Interconnect Resistivity: Nova Materia, Daniel Gall, Rensselaer Institutum Polytechnicum
o Metrologia et Characterizationis materialis pro Era 3D Logicae et Memoria, Roy Koret;
Nova Ltd.
o Ultra FinFET machinae: GAA, CFET, 2D Materia FET, Chung-Hsun Lin, Intel o Heterogenea Integratio Utens Chiplets & Provecta Packaging, Madhavan
Swaminathan, Georgia Tech
o Design-Technology Co-Optimization/Ratio Technologia Co-Optimization, Victor Moroz,
Synopsys
• Technologiae emergentes pro Edge Computo Belgico, constituto ab Huaqiang Wu, Universitate Tsinghua et Ioanne Paulo Strachan, Forschungszentrum Juliacensi.
o Mobile NPUs for Intelligent Human/Computer Interaction, Hoi-Jun Yoo, KAIST
O Brain-inspirati Strategies ad Optimizing Consilium Neuromorphic Sensorium-Processing
Systema Giacomo Indiveri, Univ
o Memoria-Substructio AI & Data Analytics Solutiones, Euicheol Lim, SK hynix
o Strategies materialia pro Memristor-Substructio AI Hardware et earum Heterointegratio;
Jeehwan Kim, MIT
o RRAM Devices pro Data Storage et In-Memoria Computing, Wei Lu, University of
o exsequendam vim Wireless practicam translationis, Hubregt Visser, IMEC
• Venditor exhibitio semel iterum tenebitur. Plura de IEDM
Ad adnotationem et alia indicia, visita www.ieee-iedm.org.
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