Skywater, Deca sign packaging pact

Skywater, Deca sign packaging pact

The companies are endeavoring to establish the first high volume FOWLP capability in the U.S. to bring proven solutions for single and multi-die packaging and advanced heterogeneous integration capability for chiplets through 2.5D and 3D implementations.

Deca’s  Adaptive Patterning with mask-less laser direct imaging delivers high-density design rules and high production yields in a cost-effective miniaturized format.

Deca’s second generation FOWLP technology includes 2 µm RDL features combined with industry-benchmark 20 µm bond pad pitch and targets advanced mobile devices, high-performance computing (HPC), high-end networking, artificial intelligence (AI), and edge computing as well as high density 3D integration technology in medical and defense applications.