The companies are endeavoring to establish the first high volume FOWLP capability in the U.S. to bring proven solutions for single and multi-die packaging and advanced heterogeneous integration capability for chiplets through 2.5D and 3D implementations.
Deca’s Adaptive Patterning with mask-less laser direct imaging delivers high-density design rules and high production yields in a cost-effective miniaturized format.
Deca’s second generation FOWLP technology includes 2 µm RDL features combined with industry-benchmark 20 µm bond pad pitch and targets advanced mobile devices, high-performance computing (HPC), high-end networking, artificial intelligence (AI), and edge computing as well as high density 3D integration technology in medical and defense applications.